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A robotic hand that inserts and removes wafers to and from a carrier without contact.
Wafers can be transported non-contact. The thin hand allows for the insertion and removal of wafers to and from the carrier. Usable in a clean room. Alignment is possible.
Non-contact robotic hand
By ejecting gas, it generates negative pressure through the ejector effect and Bernoulli effect, and positive pressure through the pressure-type air cushion effect, allowing the workpiece to be suspended in a non-contact state, enabling transport, inversion, and tilting. It is also referred to as a Bernoulli chuck. The exhaust recovery mechanism allows for use in ultra-clean rooms. It is compatible with semiconductor wafers, LCD/PDP glass substrates, printed circuit boards, ceramic substrates, films, paper, non-woven fabrics, ultra-thin workpieces, breathable workpieces, and more.
